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INTEL GEN 12TH 1-9 12900F

Product Model: INTEL I9 12900F BRAND: Intel Country Origin: India

Intel's 12th generation processors, known as Alder Lake, introduce a hybrid architecture with performance and efficiency cores. This design boosts multitasking and gaming performance while supporting DDR5 memory and advanced technologies.

30000.00


Features

The Intel Core i9-12900F is a high-performance processor from Intel’s 12th generation Alder Lake lineup, built to deliver exceptional computing power for gamers, professionals, and enthusiasts. Featuring Intel's Performance Hybrid Architecture, this CPU combines a mix of Performance-cores (P-cores) and Efficient-cores (E-cores), optimizing workload management for superior multitasking and responsiveness. As an "F" variant, the processor lacks integrated graphics, making it an ideal choice for systems relying on discrete GPUs.


Core Specifications:

  • Hybrid Core Architecture:

    • Performance-Cores (P-Cores): 8 cores for high single-threaded performance, crucial for gaming and demanding applications.
    • Efficient-Cores (E-Cores): 8 cores for handling background tasks and multi-threaded workloads efficiently.
    • Total Cores/Threads: 16 cores (8P + 8E) and 24 threads.
  • Clock Speeds:

    • P-Cores Base Clock: 2.4 GHz
    • P-Cores Turbo Boost Clock: Up to 5.1 GHz
    • E-Cores Base Clock: 1.8 GHz
    • E-Cores Turbo Boost Clock: Up to 3.8 GHz
  • Cache:

    • L3 Cache: 30MB Intel Smart Cache
    • L2 Cache: 14MB (shared across cores)


Architectural Highlights:

Performance Hybrid Architecture:

The Intel Core i9-12900F leverages a hybrid architecture, with the Intel Thread Director dynamically assigning tasks to P-cores and E-cores for optimal performance and energy efficiency. This architecture excels at balancing high-priority workloads with background tasks, ensuring seamless multitasking.

No Integrated Graphics:

As an "F" variant, the 12900F does not feature integrated graphics, making it a cost-effective choice for users who exclusively utilize discrete GPUs.

Fabrication Technology:

Built on Intel’s 7nm Enhanced SuperFin process (Intel 7), the processor achieves improved efficiency and thermal performance compared to previous generations.


Performance and Use Cases:

Gaming:

  • Top-Tier Gaming: The 12900F delivers high frame rates and smooth gameplay in modern AAA titles, particularly when paired with a high-performance GPU.
  • High-Refresh-Rate Optimized: Its strong single-threaded performance makes it ideal for high-refresh-rate gaming monitors.

Content Creation:

  • Professional-Grade Performance: The CPU's 24 threads and large cache make it excellent for demanding creative tasks like 4K video editing, 3D modeling, and rendering.
  • Efficient Workflows: Multi-threaded workloads are accelerated by the E-cores, while P-cores handle high-priority tasks.

Productivity:

  • Multitasking Powerhouse: Its hybrid architecture ensures that productivity applications run smoothly even with multiple programs open.
  • Future-Ready Workloads: Perfect for professionals needing a processor that can handle next-generation applications and workflows.


Advanced Features:

  • Memory Support:

    • Compatible with both DDR5 (up to 4800 MT/s) and DDR4 (up to 3200 MT/s) memory standards, providing flexibility for builders.
  • PCIe 5.0 and 4.0:

    • Equipped with 16 PCIe 5.0 lanes and 4 PCIe 4.0 lanes, ensuring compatibility with cutting-edge GPUs and storage devices for exceptional performance.
  • Intel Thread Director:

    • Optimizes performance by intelligently directing workloads to the most suitable cores based on real-time analysis.
  • Efficient Multi-threading:

    • Ensures background processes don't interfere with high-performance tasks, maintaining a responsive system under heavy load.


Power and Thermal Considerations:

  • Thermal Design Power (TDP):

    • Base TDP: 65W
    • Maximum Turbo Power: 202W, highlighting the need for robust cooling solutions for sustained high-performance tasks.
  • Cooling Recommendations:

    • While the processor may include a stock cooler, users are encouraged to use a higher-end air or liquid cooling solution for better thermal management, especially during intensive workloads.

Specifications
TOTAL NUMBER OF CORE 16
TOTAL NUMBER OF PERFORMANCE CORES 8
TOTAL NUMBER OF EFFICIENT CORES 8
TOTAL NUMBER OF THREADS 24
MAX RAM MEMORY SUPPORT 128 GB
MOTHERBOARD SUPPORT 600 / 700 SERIES
MEMORY SUPPORT DDR-4 UPTO 3200 MT/S, DDR-5 UPTO 4800 MT/S
MAX MEMORY BANDWIDTH 76.8 GB/S
EFFICIENT CORE BASE FREQUENCY 1.80 GHZ
EFFICIENT CORE MAX TURBO FREQUENCY 3.80 GHZ
PERFORMANCE CORE BASE FREQUENCY 2.40 GHZ
PERFORMANCE CORE MAX TURBO FREQUENCY 5.10 GHZ
SOCKET TYPE LGA 1700
LITHOGRAPHY 7NM
TOTAL CACHE 30 MB
TOTAL L2 CACHE 14 MB
THERMAL JUNCTION 100
PCIe REVISION 4
MAX NUMBER OF PCIe LANES 20
PROCESSOR TDP 202 W
INBUILT GRAPHIC PROCESSING UNIT NO
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